MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517072415 A) filed by Asahi Kasei Kabushiki Kaisha, Tokyo, on July 30, for 'thermoplastic resin composition, molded article and communication device component.'
Inventor(s) include Tokuyama Miki; Kuramitsu Masahito; and Teshima Yuta.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "The purpose of the present invention is to provide a thermoplastic resin composition which functions as a material for a communication device component which has excellent performance as an antenna, and specifically, still has excellent performance as an antenna when injection-molded at a high temperature, regardless of the injection molding conditions. The present invention is characterized by containing a polyphenylene ether resin and a laser direct structuring (LDS) additive, and in that the inter-particle distance of the LDS additive is 2.2-3.2 m, the Vicat softening temperature is at least 90 C and the water absorption rate is no greater than 1.5%."
The patent application was internationally filed on Feb. 28, 2024, under International application No.PCT/JP2024/007423.
Disclaimer: Curated by HT Syndication.
