MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079243 A) filed by Techno-Umg Co. Ltd., Tokyo, on Aug. 21, for 'thermoplastic resin composition and molded article.'
Inventor(s) include Hayashi Ichiyo; and Shinohara Yoshiaki.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "A thermoplastic resin composition comprising a polycarbonate resin (A), a rubber-reinforced vinyl resin (B), a non-rubber-reinforced vinyl resin (C), and a lubricant (D), wherein the rubber-reinforced vinyl resin (B) contains at least an ethylene-(a-olefin) rubber-reinforced resin (B1) produced by the graft polymerization of a vinyl monomer in the presence of an ethylene-(a-olefin) rubbery polymer (b1), the non-rubber-reinforced vinyl resin (C) is a copolymer containing at least an acrylonitrile unit and a styrene unit, and the lubricant (D) has a saturated fatty acid ester having 12 or more carbon atoms."
The patent application was internationally filed on Feb. 29, 2024, under International application No.PCT/JP2024/007558.
Disclaimer: Curated by HT Syndication.
