MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517020663 A) filed by Inventwood Inc., Frederick, U.S.A., on March 7, for 'truncating the distribution of modulus properties in natural populations of wood.'
Inventor(s) include Bradshaw Allan; and Winterowd Jack G.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "This disclosure is directed to methods of separating wood veneer material by property measurements and thereafter improving the properties of veneer material with property values lower than a target threshold value until those materials meet or exceed that threshold values. In some aspects of the disclosure veneer materials are prepared non destructively measured and separated into passing and failing material collections. The failing material collection may then be treated to improve the density and flexural modulus of the material therein. Also disclosed herein are products and materials incorporating the treated veneer materials according to the disclosed methods."
The patent application was internationally filed on Aug. 23, 2023, under International application No.PCT/US2023/030948.
Disclaimer: Curated by HT Syndication.
