MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202347047132 A) filed by Henkel Ag & Co. Kgaa, Duesseldorf, Germany, on July 13, 2023, for 'two-part epoxy-based structural adhesive composition.'
Inventor(s) include Li, Bin; Qi, Yalong; Chen, Chunfu; Chu, Hongyu; and Lu, Daoqiang.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "Provided is a two-part epoxy-based structural adhesive composition, which comprises a first part and a second part. The first part comprises: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less than 400 g/eq, ii) a second aromatic difunctional epoxy resin having an epoxide equivalent weight of from 400 g/eq to 3000 g/eq, and iii) a shell-core toughening agent. The second part comprises: I) a non-aromatic polyetheramide amine and II) an alicyclic amine. Moreover, provided is a method for bonding substrates by using the adhesive composition and an article bonded with the cured product of the adhesive composition and use of the composition in assembly of articles."
The patent application was internationally filed on Dec. 17, 2020, under International application No.PCT/CN2020/137057.
Disclaimer: Curated by HT Syndication.
