MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202547059039 A) filed by Qualcomm Incorporated, San Diego, on June 19, for 'ultrasonic sensor system and multi-layer stiffener for foldable display.'
Inventor(s) include Tseng, Chin-Jen; Strohmann, Jessica Liu; Badge, Ila; Lin, Shiang-Chi; Yang, Min-Lun; and Panchawagh, Hrishikesh Vijaykumar.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "An apparatus includes an ultrasonic sensor stack, a foldable display stack that includes a display stiffener, and an additional stiffener between the ultrasonic sensor stack and the foldable display stack. The additional stiffener forms an acoustic resonator with the display stiffener and an adhesive layer between the display stiffener and the additional stiffener in order to amplify transmission of ultrasonic waves transmitted by the ultrasonic sensor stack. The additional stiffener includes a material having a high modulus of elasticity, low density, and high acoustic impedance value. In some cases, the additional stiffener includes a metal, a ceramic, a glass, or a glass ceramic. The additional stiffener increases an overall stiffness and mechanical integrity of the apparatus so that a foam backer may be omitted from the ultrasonic sensor stack."
The patent application was internationally filed on Dec. 06, 2023, under International application No.PCT/US2023/082732.
Disclaimer: Curated by HT Syndication.
