MUMBAI, India, July 11 -- Intellectual Property India has published a patent application (202511061436 A) filed by Thapar Institute Of Engineering & Technology, Patiala, Punjab, on June 27, for 'vacuum-based clamping device for 3d surfaces and system thereof.'
Inventor(s) include Anant Kumar Singh; and Ajay Berry.
The application for the patent was published on July 11, under issue no. 28/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a vacuum-based clamping device (100) and system (1000) for securing 3D surfaces and providing a reliable and precise method for holding complex 3D surfaces during finishing processes that includes a vacuum chamber (102), a centering clamp (104) to hold the workpiece securely while minimizing stress, a sealing ring (106) for an airtight seal, a vacuum pump (108), and a vacuum gauge (110) to maintain the vacuum. The system (1000) further includes a base frame (200) comprising mounting holes (202), a power supply (300) to operate the vacuum-based clamping device (100) continuously; copper tapes (400) to supply power from the power supply unit (300) to the vacuum-based clamping device (100); and a magnetized MR polishing tool (500) configured to polish a 3D surface of the workpiece secured by the vacuum-based clamping device (100)."
Disclaimer: Curated by HT Syndication.
