MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517081086 A) filed by Avient Corporation, Avon Lake, U.S.A., on Aug. 27, for 'wafer carrier with scavenging device.'
Inventor(s) include Huang, Shih-Hsuan; Leedle, Melvin Joshua; Suter, John D. II; Angel, Juan; Purayath, Vinod; Messmore, Benjamin; Scaglione, Heather; and Ohama, Kenta.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "A wafer carrier includes a wafer carrier housing having an interior space and a scavenging device with a scavenging compound in fluid communication with the interior space. The wafer carrier can be used as a microenvironment for semiconductor wafers enclosed within the carrier as they move through fabrication process steps."
The patent application was internationally filed on Feb. 27, 2024, under International application No.PCT/US2024/017530.
Disclaimer: Curated by HT Syndication.
