MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202517064626 A) filed by Sumitomo Seika Chemicals Co. Ltd., Hyogo, Japan, on July 7, for 'water-absorbing resin composition, water-stopping material, and cable.'
Inventor(s) include Takahashi, Kazu.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "Provided are: a water-absorbing resin composition having excellent heat resistance; a water-stopping material containing the water-absorbing resin composition; and a cable. A water-absorbing resin composition according to the present invention includes water-absorbing resin particles and a benzimidazole compound represented by general formula (1) (in formula (1), R1 is a methyl group or a hydrogen atom, R2 is a methyl group, an amino group, a methylthio group, a phenyl group or a hydrogen atom)."
The patent application was internationally filed on Dec. 26, 2023, under International application No.PCT/JP2023/046537.
Disclaimer: Curated by HT Syndication.
