MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517038645 A) filed by Boe Technology Group Co. Ltd.; Boe Mled Technology Co. Ltd.; and Beijing Boe Technology Development Co. Ltd., Beijing, on April 22, for 'wiring substrate and method of manufacturing the same, backplane, and display device.'
Inventor(s) include Zhai, Ming; Liu, Chao; Wang, Lili; Feng, Shanshan; Zhao, Jingping; Wang, Jing; Liu, Mengqing; Wang, Huaimin; Jia, Mingming; Shi, Lingyun; and Qi, Qi.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "A wiring substrate (100). The wiring substrate (100) comprises: a base (10), and a plurality of connecting lines (012) located on the base (10), wherein the base (10) comprises a first main surface (11) and a second main surface (12) arranged opposite each other in the direction of thickness of the base (10), and a side face (13) located between the first main surface (11) and the second main surface (12), the side face (13) comprising a set side face (13A). The plurality of connecting lines (012) are located on the base (10), and the connecting lines (012) extend from the first main surface (11) to the second main surface (12) through the set side face (13A). Any one of the plurality of connecting lines (012) comprises: a first surface (Q1) and a second surface (Q2) arranged opposite each other, the first surface (Q1) being closer to the base (10) than the second surface (Q2), and the area of the first surface (Q1) being greater than that of the second surface (Q2)."
The patent application was internationally filed on Nov. 15, 2023, under International application No.PCT/CN2023/131810.
Disclaimer: Curated by HT Syndication.
