MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202414102680 A) filed by Lin Chintung on December 24, 2024, for 3d Microcrystalline Heat Dissipation Device.
Inventor includes Lin Chintung.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: ABSTRACT 3D MICROCRYSTALLINE HEAT DISSIPATION DEVICE A 3D microcrystalline heat dissipation device comprising a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity that are attached to each other. The capillary phase change heat conduction cavity is configured to be a sealing structure, and the liquid flow heat dissipation cavity is hermetically connected to a liquid inlet pipe and a liquid outlet pipe. The liquid flow heat dissipation cavity has an immersed microcrystalline structure. The bottom surface of the interior of the liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer. The heat of the heat source is conducted to the liquid flow heat dissipation cavity through the gas-liquid phase change of the capillary phase change heat conduction cavity, and then the liquid flow heat dissipation cavity quickly brings heat to the outside through the flowing refrigerant, so that efficient heat dissipation is achieved. FIG. 15
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