MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202511008825 A) filed by Indian Institute Of Technology Delhi on February 03, 2025, for A Composite Substrate For Smart Thermal Management And A Method Of Manufacturing Of The Same.
Inventors include Shib Shankar Banerjee; and Pratip Sankar Banerjee.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: ABSTRACT Title: A Composite Substrate For Smart Thermal Management And A Method Of Manufacturing Of The Same The present invention relates to a multifunctional composite material (100) including liquid metal (LM) element and magnetic particulate element dispersed within a polymeric matrix, designed to exhibit enhanced electrical conductivity, magneto-responsiveness, and tunable mechanical properties. The composite demonstrates a positive piezo-conductive behavior, where resistivity decreases under compressive and tensile loads, enabling efficient charge flow and heat generation for energy harvesting applications. The material exhibits significant flexibility and stretchability, with elongation exceeding 1000%, and can be tailored for wearable devices. It also exhibits magnetostrictive behavior, responding to external magnetic fields and generating strain, making it suitable for sensors and actuators. With drastically improved thermal conductivity and dielectric permittivity, the material is ideal for energy storage, thermal management, and flexible capacitors. Additionally, the composite retains high recoverable elasticity, ensuring long-term durability under dynamic mechanical stress. (Figs. 1)
Disclaimer: Curated by HT Syndication.
