MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202421069113 A) filed by Asawa Insulation Private Limited on September 22, 2024, for A Duct Corner Joint Assembly For A Polyisocyanurate (pir) Hvac Duct System.
Inventor includes Asawa, Manish.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: According to the present disclosure, a duct corner joint assembly (100) for a polyisocyanurate (PIR) HVAC duct system is disclosed. The duct corner joint assembly (100) comprises a base (105), a side surface (120) extending at an angle from an edge of the base, at least one central pin (110) and at least two teeth connectors (115a, 115b) extruded from the base (105). The assembly covers a joint of two polyisocyanurate (PIR) ducts and end corners. The assembly ensures a secure and leak-proof connection between the duct joints to prevent air leakage and maintain the efficiency of the duct system. The assembly provides reinforcement to the polyisocyanurate (PIR) ducts, particularly to the duct corners externally and improves appearance of the duct system. The assembly is fabricated in L-shape with two surfaces perpendicular to each other. Reference Figure:
Disclaimer: Curated by HT Syndication.
