MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202531008648 A) filed by National Institute Of Technology Rourkela on February 03, 2025, for A Hybrid Microneedle Patch And Its Scalable Fabrication Process.
Inventors include Prasoon Kumar; Mirza Khalid Baig; Kamasani Aryasree; Pragyan Ray; and Swagatika Barik.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: ABSTRACT A HYBRID MICRONEEDLE PATCH AND ITS SCALABLE FABRICATION PROCESS An apparatus for a scalable fabrication process to make a hybrid microneedle patch, comprising: a two-part mold design with an operative top part (10), and an operative bottom part (20),said operative bottom part consisting: a first set of holes (20b), being through holes, in an inner circumference with one hole (20a) in the middle;a second set of holes, being cavities, (20c), in an outer circumference;an inner circumferential ring (25) spaces apart first set of holes (20b) from second set of holes (20c) in a radial manner;said operative top part consisting: a base with a first set of cylinders (10b)for hosting said microneedles, passing through it, in an upright position;a second set of cylinders (10c)which get press-fit with said first set of holes (20c), said second set of cylinders (10c) being a second set of stubs, outer-circumferentially, protruding orthogonally, out of its base. [[FIGURE 1]]
Disclaimer: Curated by HT Syndication.
