MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202621029029 A) filed by Deshpande, Kaustubh; and Ramakrishnan, Arjun on March 11, 2026, for A Method For Patterning Adhesive On Microfabricated Neural Probes And Use Thereof.
Inventors include Deshpande, Kaustubh; and Ramakrishnan, Arjun.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention relates to a method for patterning adhesive on microfabricated neural probes. Further, the patterned neural probes are configured to be assembled around cylindrical carriers to enable fabrication of cylindrical multi-electrode arrays for use in human medical devices. The arrays may further be employed in animal and life science applications, particularly in electrophysiological recording systems utilizing microelectrode arrays for neural signal acquisition and monitoring.
Disclaimer: Curated by HT Syndication.
