Intellectual Property India Publishes Patent Application for A Method Of Curing A Layer Deposited On A Substrate And A Substrate Made Using The Method.

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617097068 A) filed by Nanize As on August 11, 2026, for A Method Of Curing A Layer Deposited On A Substrate And A Substrate Made Using The Method..

Inventors include Iwu, Kingsley Odinaka; Hogg, David; and Singh, Vivek Kumar.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: The present invention relates to a method of curing a layer deposited on a substrate, the layer comprising a coating formulation containing hydrolysable Si-X groups wherein X is selected from a halogen, C1-6 alkoxy, hydrogen, -NH-Si or -NH2. The coating formulation is dissolved in a solvent when applied to the substrate. The method includes drying the layer at a temperature not greater than 20 °C above the boiling point of the solvent and subjecting the layer to a curing vapour. The present invention also relates to a substrate made using this method.

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