MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094357 A) filed by Vlinge Innovation Ab on August 04, 2026, for A Method To Produce A Board Element And A Panel.
Inventors include Nygren, Per; and Josefsson, Per.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The present disclosure relates to a method to produce a board element (1), including extruding a substrate (2) comprising one or more substrate layers through a die, laminating a thermoplastic film (3) to a first surface (2a) of the substrate (2) after the substrate (2) has passed the die, printing by a digital printing device a décor on a surface of the thermoplastic film (3) when the thermoplastic film (3) has been laminated to the substrate (3), and applying a coating (5) directly on the printed thermoplastic film (3) after printing. The disclosure also relates to a panel, such as a building panel, including a mechanical locking system.
Disclaimer: Curated by HT Syndication.