MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202611059419 A) filed by Noida Institute Of Engineering And Technology Pharmacy Institute on May 10, 2026, for A Microneedle Patch For Painless Vaccine Delivery.
Inventors include Madhurima; and Swati Yadav.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: A microneedle patch for painless vaccine delivery is disclosed. The patch includes a flexible backing layer, an adhesive retention zone, and a microneedle array carrying vaccine-loaded dissolvable microprojections. The microprojections include a stabilizing matrix containing a vaccine antigen and pharmaceutically acceptable polymeric excipients. Upon skin application, the microprojections penetrate the stratum corneum, hydrate through interstitial fluid, and release the vaccine into superficial immune-responsive tissue. The patch may include a release liner and application indicator to improve handling, dose delivery, and user compliance.
Disclaimer: Curated by HT Syndication.
