MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202441056585 A) filed by Titan Company Limited on July 25, 2024, for A Mold Assembly.
Inventors include Laxmidhar Biswal; Naveen Prabhu G; Jithin M; and Jayakumar.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: TITLE: “A MOLD ASSEMBLY” A mold assembly (100) for manufacturing an article (300) is disclosed. The mold assembly (100) includes a base (1) defined with a plurality of holes (9), each hole of the plurality of holes (9) receives at least one pin (4). The mold assembly (100) includes a shape forming structure (7) disposable on each of the at least one pin (4). The mold assembly (100) includes a first die part (2) and a second die part (3) defined with cut-outs (8a, 8b), removably disposed on the base (1). The mold assembly includes a cavity (8) formed on assembly of the first die part (2) and the second die part (3). The cavity (8) formed over the shape forming structure (7) is configured to receive molten material for manufacturing the article (300). Thus, the mold assembly ensures consistent positioning of the shape forming structure in each molded article.
Disclaimer: Curated by HT Syndication.
