MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202511001373 A) filed by Hero Motocorp Ltd. on January 07, 2025, for A Mounting Assembly For An Electronic Component Of A Vehicle.
Inventors include Barthwal, Paras; and Deb, Prithij.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present disclosure discloses a mounting assembly (10) for an electronic component (80) of a vehicle (100). The mounting assembly comprises a first bracket (2) connectable to one side (112) and a second bracket (30) fixable to other side (114) of the seat rail (110). The first bracket (2) comprises a body (50) defined with a first section (4), a second section (6), and a third section (8). The mounting assembly (10) comprises a stay member (20) comprising ends (22) fixable to the seat rail (110). The ends (22) are bent to define a gap (24). The second bracket defined with a first portion and a second portion. The first portion comprises a protrusion (36) slidably receivable in the gap. The second portion is couplable to third section (8) of the first bracket, for coupling with the other side of the seat rail (110) and accommodating the electronic component (80).
Disclaimer: Curated by HT Syndication.
