MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641068080 A) filed by Aditya University; Aditya College Of Engineering And Technology A; Aditya College Of Pharmacy A; and Aditya Degree College on May 30, 2026, for A Multi-Dimensional Layout Marking Device With Indexed Linear Positioning And Synchronized Dimensional Transfer.
Inventors include Dr. Nanduri Sujatha; Sana Vani; Ahamed Naseemuddin; Dr. Narla Divya; and Dr. Korupolu Nagu.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The present disclosure proposes a multi-dimensional layout marking device (100) configured to perform angular marking, linear positioning, dimensional layout transfer, slot and depth measurement, and controlled dot-punch marking for facilitating accurate and repeatable multi-dimensional layout operations during fabrication and machining applications. The multi-dimensional layout marking device (100) comprises a base assembly (102), a sliding assembly (112), an angular adjustment arrangement (116), a transfer assembly (118), a punch assembly (126), and a level indicator (136). The multi-dimensional layout marking device (100) facilitates indexed linear positioning, angular referencing, dimensional transfer, and punch referencing operations during multi-dimensional marking applications. The multi- dimensional layout marking device (100) increases operational efficiency, layout consistency, and dimensional repeatability during woodworking, metalworking, machining, and fabrication processes.
Disclaimer: Curated by HT Syndication.
