MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202641081439 A) filed by A Vikram on July 01, 2026, for A Multi-Segmented Modular Sensory Apparatus With Hardwired Data-Diode Isolation For High- Pressure Conduits.
Inventor includes A Vikram.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention discloses a multi-segmented modular sensory apparatus with hardwired data-diode isolation for high-pressure conduits. The apparatus comprises a segmented, clamp-on modular shell casing configured to mechanically couple around a live fluid conduit with zero pressure boundary penetration. The shell casing includes a plurality of interlocking segments enclosing a spatial matrix of electromagnetic acoustic transducers (EMAT) and ultrasonic wave sensing nodes. A hardwired physical data-diode circuit assembly is integrated inside the casing, establishing an optoelectronic unidirectional optical transmission path that structurally enforces a 100% read-only, one-way outward telemetry pipeline immune to external electronic overrides. The entire electrical network is enclosed within an explosion- proof casing conforming to ATEX-certified intrinsic safety limits, and is protected by an outer shell layer of marine-grade polymers for extreme environmental resilience.
Disclaimer: Curated by HT Syndication.
