MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641051220 A) filed by Dr. A. Arun Negemiya; S. Naga Prasad; N. Mohamed Rizwan; S. Shanmugaraj; and Y. K. Siva Saveen on April 22, 2026, for Additively Manufactured Aluminium Sandwich Deck Plate With Integrated Heatpipe Cooling.
Inventors include Dr. A. Arun Negemiya; S. Naga Prasad; N. Mohamed Rizwan; S. Shanmugaraj; and Y. K. Siva Saveen.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: A novel additively manufactured aluminum sandwich deck plate with integrated heatpipe-based cooling is disclosed for aerospace avionics applications. The structure consists of aluminum face sheets and a lattice core embedding triangular heatpipe channels with gyroid wick structures and vapour pathways. The system enables efficient two-phase heat transfer within the structural component, eliminating the need for external thermal management systems. Fabricated using laser powder bed fusion and sealed via advanced joining techniques, the invention achieves reduced weight, cost, and complexity while enhancing thermal performance and reliability. This multifunctional design represents a significant advancement in aerospace structural and thermal integration.
Disclaimer: Curated by HT Syndication.
