MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617061433 A) filed by Nissan Chemical Corporation on May 14, 2026, for Adhesive Composition, Laminate, And Method For Manufacturing Processed Semiconductor Substrate.
Inventors include Okuno Takahisa; Yanai Masaki; Usui Yuki; and Shinjo Tetsuya.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Provided is an adhesive composition for forming an adhesive layer to be used in temporarily bonding a semiconductor substrate or an electronic device layer and a support substrate, wherein: after the semiconductor substrate or the electronic device layer and the support substrate are temporarily bonded via the adhesive layer, the force required for inserting a material having a sharp portion between the semiconductor substrate or the electronic device layer and the support substrate when the semiconductor substrate or the electronic device layer is mechanically peeled from the support substrate using the aforementioned material is 10.0 kgf or lower; and the storage elastic modulus of the adhesive layer is 30 MPa or higher.
Disclaimer: Curated by HT Syndication.
