MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617061429 A) filed by Nissan Chemical Corporation on May 14, 2026, for Adhesive Composition, Stack, And Production Method For Processed Semiconductor Substrate.
Inventors include Yanai Masaki; Shinjo Tetsuya; Usui Yuki; Okuno Takahisa; Yagyu Masafumi; and Sakaguchi Kana.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: This adhesive composition for forming an adhesive layer used for temporarily bonding a semiconductor substrate or an electronic device layer and a support substrate, the adhesive composition containing a release agent component, the absolute value of the difference (A - B) between surface free energy (A) of the semiconductor substrate or the electronic device layer and surface free energy (B) of the release agent component being 20 mN/m or less.
Disclaimer: Curated by HT Syndication.
