MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202521002369 A) filed by Hindustan Aeronautics Limited on January 10, 2025, for Adhesive For Ferrous, Non-Ferrous Metals And Rubber Materials Bonding.
Inventors include Ajit B. Bhandakkar; S. R. Mukunde; Smita S. Patil; and Bineeta B. Raut.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The invention relates to development of an adhesive used for gluing ferrous and non-ferrous metals, metals to non-metals and non- metals to non-metals, composition in particular to Nitrile phenolic epoxy base for use in aerospace industry. It is developed by formulating process in order to meet aircraft applications. The developed adhesive comprises of polymer and chemicals i.e., base polymer, Acrylo nitrile butadiene rubber, Vulcanising agent, Zinc oxide, Solvents (Methyl Ethyl Ketone and rectified Spirit), Chemical CT5900, Dicyanmide, 65% Resol phenol formalin Resin. The adhesive is evaluated for properties like, viscosity, content of non-volatile substance, shear strength of glue joint, bending of adhesive film after solidification, heat resistance of glue film after solidification by ageing at elevated temperature and corrosion resistance for working in temperature from -60 0C to +60 0C.
Disclaimer: Curated by HT Syndication.
