MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202641077172 A) filed by Siddhartha Institute Of Technology & Sciences on June 22, 2026, for Ai-Based Smart Crack Detection And Structural Health Monitoring System.
Inventors include Dr. Poleboyana Rohit; Dharavath Raghupathi; Pitla Srividya; Gollanolla Sudhakar; G. Sai Shruthi; Katukoori Veda Samhitha; Vavilla Kavitha; Parigala Mounika; Bhukya Swapa; and Ravirala Sushma.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present disclosure concerns an Artificial Intelligence-Based Smart Crack Detection and Structural Health Monitoring System and method for automated infrastructure inspection, damage assessment, condition monitoring, deterioration prediction and maintenance planning. The proposed framework consists of various components, including image acquisition devices, sensor networks, image preprocessing methods, multimodal sensor data fusion mechanisms, image crack detection engines based on artificial intelligence, structural health evaluation modules, deterioration prediction engines, remaining useful life estimation modules, cloud-based monitoring platforms, and maintenance recommendation systems. The structural images and sensor data are continually processed to detect cracks, assess damage level, compute structural health indices, provide future degradation forecasting, estimate operational life and provide maintenance plans. According to the disclosed invention, real-time monitoring of infrastructure, predictive maintenance planning, improved infrastructure safety management, reduced operational expenses, and increased infrastructure reliability are achieved. The invention can be used in bridges, buildings, dams, tunnels, industrial facilities, transportation systems, pipelines and other critical infrastructure systems
Disclaimer: Curated by HT Syndication.
