MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202641061723 A) filed by Sri Venkateswara College Of Engineering & Technology, Chittoor on May 15, 2026, for Ai Integrated Serpent Closed Loop Pulsating Heat Pipe.

Inventors include Dr. Palleti Venkataramana; Dr. Ankammarao Padamurthy; Dr. Panga Narasimha Reddy; Dr. S. Gouse Mohiddin; Dr. S. Arunsaco; Dr. G. Balasundaram; Dr. T. Somassoundaram; M. Lalithya; Dr. M. Chittaranjan; and Dr. M. Mohan Babu.

The application for the patent was published on July 10, 2026, under issue no. 28/2026.

Abstract: ABSTRACT closed-loop pulsating heat pipe (CLPHP) for enhanced heat transfer application in electronics loop pulsating heat pipe for thermal which leads cooling and i that promote nncleation and hybrid nanoflnid comprises a to reduce thermal resistance to system contains alternating This invention relates to a utilizing hybrid nanofluids to thermal management energy system. A do sed management of energy system consists of a serpentine structure to increase effective heat transfer area, reduce overall footprint and provide multiple bend locations propagation of vapor plugs. The nanoparticle concentration selected increase the heat transfer. The evaporator and condenser (llO) segments along the path such that liquid vapor plugs repeatedly pass through sequential heating and cooling zones, enhancing cyclic latent heat transport. The condenser (llO) region comprises variable surface textures to increase heat rejection efficiency and stabilize oscillatory flow. Additionally, a sensor and control module is enabled to monitor pressure, temperature, flow pulsation, and heat transfer rate and adaptively control operating conditions of the pulsating heat pipe. Solenoid valve (107) is used for regulating pressure and maintaining proper flow conditions during operation. Heat transfer rate and thermal resistance are analysed by evaluating the system under various operating situations. This architecture and technique outperform conventional system in terms of thermal performance for advanced cooling applications (Figure 1)

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