MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202621060159 A) filed by Vishwakarma Institute Of Technology on May 12, 2026, for An Extrusion Mechanism For Soil 3d Printing.
Inventors include Rajurkar, Avadhoot; Kotwal, Girish; Borawake, Pratham; Rokade, Tanishq; and Shaikh, Fiza.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention is related to an extrusion mechanism for soil 3D printing. According to the invention, a soil 3D printing design with an extrusion mechanism designed for mounting on industrial robotic arms The design enables precise movement and positioning during the printing process. The setup comprises housing for encasing as well as supporting components of the extrusion mechanism. Further, it consists of a motorized pump mechanism (104) to extrude the soil mixture through a nozzle (114). The system also includes fixtures for installing the robotic arm. The invention incorporates a user-friendly dismantling capability, allowing efficient disassembly into individual components for transport, storage, and replacement purposes. The soil 3D printing system demonstrated in this design showcases its versatility and practicality. The versatile nature of this soil 3D printing system opens up possibilities for applications in architecture, construction, and environmental engineering, providing sustainable and costeffective solutions for creating customized structures.
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