MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202641083192 A) filed by Koneru Vijaya Lakshmi; Koneru Lakshmaiah Education Foundation; and Ramatenki Chinna on July 06, 2026, for An Intelligent Adaptive Control System And Method For Real-Time Energy-Efficient Wire Electrical Discharge Machining Using Artificial Intelligence And Multi-Objective Optimization.
Inventors include Ramatenki Chinna; Boggarapu Nageswara Rao; and Sireesha Koneru.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present invention relates to an intelligent Artificial Intelligence (AI)-based adaptive control system and method for real-time energy-efficient Wire Electrical Discharge Machining (WEDM). The system comprises a Sensor Network, Data Acquisition Unit, Data Preprocessing Module, Artificial Intelligence Prediction Engine, Multi-Objective Optimization Engine, Decision Support Module, Adaptive Controller, Knowledge Database, Continuous Learning Module, Response Monitoring Module, and Human– Machine Interface configured in a closed-loop adaptive control architecture. During machining, real-time process data are continuously acquired and processed to predict machining responses, including Material Removal Rate (MRR), Surface Roughness (Ra), Electrical Power Consumption (PC), Kerf Width (KW), Dimensional Accuracy (DA), and Wire Wear Ratio (WWR). The predicted responses are optimized and validated before automatically updating machining parameters during machining operations. The Continuous Learning Module incrementally updates the Artificial Intelligence Prediction Engine using newly acquired machining data to improve prediction accuracy and adaptive control performance. The invention enhances machining productivity, dimensional accuracy, process stability, surface quality, and energy efficiency while reducing electrical power consumption, machining cost, and operator intervention. The proposed system is suitable for precision machining of electrically conductive materials in smart manufacturing and Industry 4.0 environments.
Disclaimer: Curated by HT Syndication.
