MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202641091617 A) filed by Prof. Rajeswari Seshadri on July 28, 2026, for An Intelligent Sensor-Integrated System For Real-Time Measurement And Prediction Of Nano-Scale Thermal Conductivity.
Inventors include Dr. Karunakar Shakampally; A. Radhika; Dr. Balraju Gande; Dr. Vikash Kumar Sinha; Dr. Narsimhulu Dunna; Dr. Sreenivasulu Ballem; Prof. Rajeswari Seshadri; and Dr. Shankar Rao Munjam.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention relates to an intelligent sensor-integrated mathematical platform for real-time measurement, modeling, estimation, and prediction of nano-scale thermal conductivity. The platform integrates intelligent thermal sensors, multi-sensor data acquisition, inverse heat transfer models, numerical computation, artificial intelligence, machine learning, optimization algorithms, uncertainty quantification, digital twin technology, and cloud-edge computing within a unified framework. Real-time thermal data collected from multiple sensors undergo adaptive sensor fusion and noise reduction to generate reliable measurements. The processed data are analyzed using inverse mathematical heat transfer models and numerical optimization to estimate nano-scale thermal conductivity accurately. Artificial intelligence, including deep learning and physics-informed neural networks, predicts thermal behavior under varying operating conditions. The system further incorporates self- calibration, anomaly detection, predictive analytics, uncertainty estimation, and digital twin synchronization to enhance accuracy, reliability, and computational efficiency. The invention enables rapid, adaptive, and precise thermal conductivity characterization for semiconductor, nanoelectronic, thermoelectric, aerospace, biomedical, energy, and smart manufacturing applications.
Disclaimer: Curated by HT Syndication.
