MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647087008 A) filed by Asml Netherlands B. V. on July 16, 2026, for Apparatus And Method For Multi-Stage Die Bonding.
Inventors include De Jager, Pieter, Willem, Herman; Schouten, Christine, Henriette; Dolk, Victor, Sebastiaan; Wahbeh, Lotfi; Assendelft, Joep; Bustraan, Krijn, Frederik; Sahin, Buket; Alleleijn, Joep, Hanni, Hub, Maria; Broers, Sander, Christiaan; and Venugopalan, Syam, Parayil.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: An apparatus and method of operating said apparatus, the apparatus comprising at least a first stage configured to support one or more donor dies and a second stage configured to support one or more target dies, the apparatus configured to measure a position of the one or more donor dies and configured to measure a position of the one or more target dies and to provide relative movement between at least one of the one or more donor dies and a corresponding one of the one or more target dies for die bonding by movement of the first stage and/or the second stage.
Disclaimer: Curated by HT Syndication.
