MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202541040909 A) filed by Ciena Corporation on April 28, 2025, for Assemblies And Methods For Cooling And Heating Components In An Outdoor Conduction Cooled Clamshell Network System.
Inventors include Ranjeet Chaurasiya; Rampratap Mahawar; Shubham Kumar; Chander Prakash Gupta; Suyash Agrawal; and Mukul Tripathi.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A thermal management assembly including a cage adapted to receive a pluggable optical module, an evaporator plate disposed adjacent to and in thermal communication with one side of the cage and the pluggable optical module when received in the cage, a condenser plate disposed adjacent to an opposite side of the cage and the pluggable optical module when received in the cage, where the condenser plate is adapted to be disposed adjacent to and in thermal communication with an inside surface of a base or a lid of a clamshell chassis, and one or more heat pipes disposed between and thermally coupling the evaporator plate to the condenser plate around the cage, thereby forming a thermal transfer path between the evaporator plate and the condenser plate. A passive energy transformation, transportation, and regeneration assembly is also provided for use in a clamshell chassis.
Disclaimer: Curated by HT Syndication.
