MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617062917 A) filed by Aperam on May 18, 2026, for Assembly And Method For Cutting A Tie By Means Of A Remote Laser.
Inventors include Latouche, Baptiste, Pierre, Jean; Guillotte, Ismal, Romaric, Alexis; Diet, Francis, Jean, Dominique; and Bardet, Eric, Jules, Andr.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The invention relates a cutting assembly (10) for cutting at least one tie (6) surrounding a product (8), the cutting assembly (10) comprising: - a cutting unit (12), configured to emit laser beams (15) focused on the tie (6); - a control unit (14), configured to detect the presence of the tie (6) and the position of the tie (6) with respect to an optical system (18) of the cutting unit (12), and, based on the detected position of the tie (6), to order the cutting unit (12) to perform a series of at least two steps of cutting a continuous portion (20) of the tie (6) from a first transverse edge (61) to a second transverse edge (62) of the tie (6).
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