MUMBAI, India, Sept. 7 -- Intellectual Property India has published a patent application (202617023142 A) filed by Samsung Electronics Co. , Ltd. on February 26, 2026, for Association Parameter Handling For Wireless Networks.
Inventors include Nayak, Peshal; Ng, Boon Loong; Shafin, Rubayet; Ratnam, Vishnu Vardhan; and Qi, Yue.
The application for the patent was published on September 04, 2026, under issue no. 36/2026.
Abstract: In an embodiment, an AP MLD that participates in a logical AP MLD operation can divide association identifiers (AIDs) amongst themselves whereby each AP MLD can then choose AID values only out of the portion of the AID space that is allocated to it, and the AP MLD may dynamically increase the bits for an AID representation in order to increase the feasible AID values.
Disclaimer: Curated by HT Syndication.
