MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617084271 A) filed by Samsung Electronics Co. , Ltd. on July 09, 2026, for Association Procedures For Seamless Roaming In Wireless Networks.
Inventors include Nayak, Peshal; Ng, Boon Loong; Shafin, Rubayet; Ratnam, Vishnu Vardhan; and Qi, Yue.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Embodiments in accordance with this disclosure provide for a station to associate with a seamless roaming domain by transmitting a message that indicates an intent to associate with the seamless roaming domain, whereby an AP affiliated with the seamless roaming domain may transmit a confirmation of the association upon which the station may seamlessly roam between APs affiliated with the seamless roaming domain.
Disclaimer: Curated by HT Syndication.
