MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202411095110 A) filed by Lg Electronics Inc. on December 03, 2024, for Automated Analysis Of A Plurality Of Parameters Associated With Moldflow In An Injection Molding Process.
Inventors include Bairoju Shivani; and Choi Hyung Seok.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: An automated system (100) for detecting at least one parameter associated with a Moldflow in an injection molding process is provided. The system (100) includes a user interface (102) to provide a Computer Aided Design (CAD) file of at least one product, a data acquisition module (104) configured to obtain at least one parameter associated with at least one product, and a controller (106) communicatively coupled to a memory (108). The controller (106) configured to determine based on the analysis at least one parameter associated with at least one product and the data stored in the memory (108) using a random forest-based regression model at least one parameter associated with the Moldflow of the product in the injection molding process to optimize the time required for analyzing at least one parameter associated with the injection molding process.
Disclaimer: Curated by HT Syndication.
