MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617084448 A) filed by Nippon Steel Corporation on July 09, 2026, for Automobile Rear Module.
Inventors include Kubo Masahiro; Kimoto Naoki; Shirakami Satoshi; Yoshida Hiroshi; Ikegami Kenta; Fujita Soshi; Suzuki Yuki; Tabata Shinichiro; Iguchi Keinosuke; and Irikawa Hideaki.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: This automobile rear module is for reinforcing side outers of an automobile and is formed by hot-stamp molding a plurality of integrated steel plates. When the projected area as viewed from the vertical direction of a reference plane is indicated by S (m2), and among components of the automobile rear module, the total weight of the components is indicated by W (kg), and the total weight of steel components each having a plate thickness of 1.5 mm or less and a minimum Vickers hardness of HV230 or more is indicated by WA, W/S is 24 or less and WA/W is 0.30 or more.
Disclaimer: Curated by HT Syndication.
