MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641049974 A) filed by Mepco Schlenk Engineering College; P. S. Aswini; and I. Baskar on April 20, 2026, for Bio Composite Hempcrete Panels With Natural Additives For Improved Thermal Efficiency.
Inventors include P. S. Aswini; I. Baskar; R. Jebarlin Bincy; and P. Mahalakshmi.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Viifllw-ilfiJD~id Wt tl~inable building material has grown in recent years due to the high energy consumption and excessive carbon dioxide emission of the conventional building materials used. Hempcrete which is made of hemp shiv, lime binder and water, serves as a potential bio [based sustainable building material. Its high porosity, thermal conductivity and good acoustic [properties offer a solution towards the rising demand for eco-friendly building materials. In genera hermal conductivity of hempcrete ranges from 0.06 to 0.16 wm-1Kl, based on its density and !binder ratio. The study was conducted on hempcrete composite panels by incorporating th pozzolanic material Metakaolin at varying percentages (7.5%, 10%, 12.5% and 15%) as a partial replacement to the lime binder, which was further modified using Gum Arabic at concentrations o 3% and 5%. The resulting panel had a density of900 kg/m3 . The same binder composition was als employed in fabricating the composite prepared using treated hemp shives. The evaluated thermal conductivity of the hempcrete indicated that the incorporation of Gum Arabic modified the matrix ~ith reduced water content and thereby improving the thermal insulation properties of the hempcrete composites. The composite panel fabricated by partially replacing lime with 15'Y Metakaolin, modified with 5% GA showed better thermal conductivity of 0.092 wrn-1K-1 than the ': . -::'ยท .~ . ':; - ~ . ::- conventional panel. The planl based bio polymer enhanced the bonding, improving lhe bindet properties with reduced water binder ratio of the sample. Hempcrete consistently showed strong IIJotential as an effective thermal insulating material due to its low thermal conductivity and highly IIJorous structure, thereby offering a promising solution tor sustainable and energy-efficien construction, regardless of variations in binder replacement and treatment processes.
Disclaimer: Curated by HT Syndication.
