MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202631086067 A) filed by Adamas University on July 14, 2026, for Biodegradable Hydrogel-Based Encapsulation Bead Composition And Preparation Method Thereof.
Inventors include Dr. Bandana Padhan; Dr. Joyjyoti Das; Ms. Parswati Sen; and Dr. Kartik Charan Lenka.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: ABSTRACT Disclosed herein is a composition (100) for biodegradable hydrogel-based encapsulation bead, the composition (100) comprises a hydrogel-forming biopolymer (102) present in 1% to 5% w/v and forms a hydrogel network and facilitates ionotropic gelation during bead formation, a polysaccharide swelling agent (104) present in 1% to 5% w/v and improves water absorption, porosity, and swelling behaviour of the hydrogel beads, a polymeric stabilizing agent (106) present in 5% to 15% w/v and enhances structural integrity, mechanical strength, and stability of the hydrogel matrix, a plasticizer (108) present in 1% to 10% v/v and improves flexibility, prevents cracking, and maintains moisture within the hydrogel beads, a microbial agent (110) present in an effective microbial concentration sufficient for controlled agricultural delivery, plant growth promotion, and rhizosphere colonization, a ionic crosslinking agent (112) present in 0.1 M to 1.0 M and crosslinks the hydrogel-forming biopolymer (102) and forms stable hydrogel beads.
Disclaimer: Curated by HT Syndication.
