MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202514109177 A) filed by Basf Se on November 10, 2025, for Cap Assembly For Tamper-Proof Sealing And Container Assembly.
Inventors include Pandit, Nishma; Sapre, Mayuresh Yashodhan; and Sasane, Sanket Nandkishor.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The invention relates to a cap assembly (10) for tamper-proof sealing of a container assembly (50), the assembly comprising: a cap (12) for opening and closing a container (52) of the container assembly (50) and a seal (14) for the sealing of the cap (12) against the container (52) connected to the cap (12) by a connecting member (16) in a sealed state of the seal (14), wherein in the sealed state of the seal (14) the seal (14) comprises a tearing portion (18) and a flange portion (20), wherein the tearing portion (18) and the flange portion (20) are arranged around the circumference of the cap (12), wherein the flange portion (20) is designed to form a form-fit and/or material-fit connection with a sealing ring (54) of the container assembly (50), and wherein the tearing portion (18) comprises at least one tearable segment (22) connected to the flange portion (20) by a first tearable connection (24), and a remaining segment (26) to remain at the cap (12) after the opening procedure, wherein the at least one tearable segment (22) and the remaining segment (26) are connected by a second tearable connection (28), wherein the connecting member (16) is designed to irreversibly transform the seal (14) from the sealed state to an unsealed state during an opening procedure to indicate that the seal (14) or of the container (52) has been opened.
Disclaimer: Curated by HT Syndication.
