MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617072804 A) filed by Samsung Electronics Co. , Ltd. on June 12, 2026, for Circuit Board And Electronic Device Comprising Same.
Inventors include Lee, Youngsun; and Kim, Byeongkeol.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present disclosure relates to a circuit board. The circuit board according to an embodiment of the present disclosure may comprise: a substrate layer positioned on a first portion of the circuit board and a second portion of the circuit board, the second portion being different from the first portion; a power line positioned on the first portion of the circuit board; a signal line positioned on the second portion of the circuit board; a shielding layer spaced apart from the power line and the signal line; and a cover layer positioned between the substrate layer and the shielding layer, wherein the cover layer includes: a cover substrate layer positioned on the first portion and the second portion of the circuit board; a conductive layer positioned on the first portion of the circuit board to correspond to the power line and positioned between the cover substrate layer and the shielding layer; and an insulating layer positioned on the second portion of the circuit board to correspond to the signal line and disposed between the cover substrate layer and the shielding layer.
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