MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202641126246 A) filed by Bapatla Surendra Babu; and Irukumalli Priyanka on October 23, 2026, for Closure-Gated Fracture-Relay Coupling Link For Cascaded Solderless Assembly Of Electromechanical Modules.
Inventors include Bapatla Surendra; and Irukumalli Priyanka.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: CLOSURE-GATED FRACTURE-RELAY COUPLING LINK FOR CASCADED SOLDERLESS ASSEMBLY OF ELECTROMECHANICAL MODULES A coupling link (100) joins two modules without solder or tools. A frangible glass fuse (110) holds, through a latch lever (136), a spring-loaded jaw (104) open on a base frame (102). When the fuse is fractured, the drive spring (134) closes the jaw, a snap hook (138) latches it, and contact pads (114) clamp onto the second module (124). A striker (116) on the jaw then strikes a waveguide horn (118) whose tip fractures the fuse of the adjacent coupling link (130). The striker engages only within a final closing travel that is 0.45 to 0.90 times the hook engagement travel, so a link fires its neighbour only after it has latched, and the chain stops at the first joint that fails to latch. A guard plate and sleeve keep fragments from firing links out of order, and coding resistors (128) detect joints that open later. FIG. 1
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