MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202421089552 A) filed by Jio Platforms Limited on November 19, 2024, for Combined Centralized And Distribution Unit (ccdu).
Inventors include Bhatnagar, Pradeep Kumar; Bhatnagar, Aayush; Kumar, Narender; Singh, Shakti; Ganesan, Selvakumar; Yadav, Aman; D Sumandas; and Gara, Madan Kishore.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: A Centralized and Distributed Unit (CCDU) is a combined unit that integrates a Centralized unit (CU) and a Distributed unit (DU) into a single housing. The CU and DU are connected through one or more thermal bridges, which are formed by Heat pipes, to dissipate heat generated by the components. The unit includes a top housing, a bottom housing, a printed circuit board (PCB) assembly, and one or more cold plates, heat sinks, and heat pipes. The unit is designed to maintain an equilibrium thermal state between the server processor, top housing, and bottom housing, and adjust the number of heat pipes and heat sinks based on spatial constraints and thermal requirements. fig.1
Disclaimer: Curated by HT Syndication.
