MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202544081216 A) filed by At & S Austria Technologie & on August 27, 2025, for Component Carrier, Method For Manufacturing A Component Carrier And Component Carrier Assembly.
Inventors include Juergen, Blasl; Sebastian, Lackner; Jim, Sierakowski; Gerhard, Schmid; and Marian, Mock.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: COMPONENT CARRIER, METHOD FOR MANUFACTURING A COMPONENT CARRIER AND COMPONENT CARRIER ASSEMBLY The present invention relates to a component carrier (100), a method for manufacturing thereof, and to a component carrier assembly, wherein the component carrier (100) comprises a stack with a plurality of electrically conductive layer structures (10, 20) and at least one electrically insulating layer structure (30), wherein the insulating layer structure (30) is stacked in between two electrically conductive layer structures (10, 20), wherein the two electrically conductive layer structures (10, 20) are electrically connected one to each other by an electrically conductive element (40) comprising an electrically conductive paste (42) provided in a cavity (41) being located in between said two electrically conductive layer structures (10, 20), wherein said cavity (41) is in lateral direction delimited by a lateral wall of the electrically insulating layer structure (30), said lateral wall having two opposed portions with different inclinations relative to a contacting plane between the electrically insulating layer structure (30) and one of said two electrically conductive layer structures (10, 20) and with respect to a thickness direction of the stack. (Fig. 5b)
Disclaimer: Curated by HT Syndication.
