MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202441053497 A) filed by Titan Company Limited on July 12, 2024, for Composite Mould And Process For Soldering Metallic Jewellery Having A Plurality Of Child Components.
Inventors include Dr. Laxmidhar Biswal; and Dr. Arabinda Meher.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: ABSTRACT “COMPOSITE MOULD AND PROCESS FOR SOLDERING METALLIC JEWELLERY HAVING A PLURALITY OF CHILD COMPONENTS” 5 The present disclosure discloses a composite mould (30) used for soldering metallic jewellery (10) having a plurality of child components (20) and a process for soldering the same. Composite mould (30) is prepared using a slurry as per the desired proportion. The plurality of child components (20) are placed on a wax sheet as per the desired design. Further, prepared composite slurry is poured on wax base and plurality of child components 10 (20), the same is cured at room temperature. Wax is peeled off and the composite mould (30) with plurality of child components (20) is subjected to drying at an elevated temperature. After drying, a solder paste is dispended on joining interfaces of the plurality of child components (20). The composite mould (30) with plurality of child components (20) and solder paste is placed in a controlled atmosphere furnace for soldering.
Disclaimer: Curated by HT Syndication.
