MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202647071627 A) filed by Henkel AG & Co. Kgaa on June 09, 2026, for Conductive Silicone Adhesive.
Inventors include Zhang, Jianfeng; Zhuo, Qizhuo; Guino, Rosette G; Bokka, Sreevalli; and Chao, Jay.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: An electrically conductive silicone adhesive that exhibits both high electrical conductivity and high adhesion strength which is useful in providing both bonding and an electrical pathway in electronic packages, also provided is a method of making the electrically conductive silicone adhesive from a curable composition including reactive organosiloxanes and electrically conductive particulate filler.
Disclaimer: Curated by HT Syndication.
