MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617096448 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on August 10, 2026, for Contact Apparatus And Relay.
Inventors include Wang, Meng; Dai, Wenguang; Su, Liji; and Chen, Songsheng.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present application relates to the technical field of electronic control devices, and in particular to a contact apparatus and a relay. The contact apparatus comprises: a static contact group, the static contact group comprising two static contacts; a movable reed assembly, wherein the movable reed assembly comprises a movable reed, and two ends of the movable reed can move relative to the static contact group, so that the two ends of the movable reed come into contact with or are separated from the static contact group; and an elastic member, wherein the elastic member is arranged on the side of the movable reed assembly distant from the static contact group, and an arc-shaped contact surface is provided between the elastic member and the movable reed assembly. The contact apparatus can realize self-adjustment of the movable reed within the movable reed assembly at any position, allowing the movable reed and the static contacts to reach a balanced contact point, thereby ensuring the effective use of the relay and improving the performance of the relay.
Disclaimer: Curated by HT Syndication.
