MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617096411 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on August 10, 2026, for Contact Assembly And Relay.
Inventors include Dai, Wenguang; Wang, Meng; Chen, Songsheng; and Su, Liji.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present application relates to the technical field of electronic control devices, in particular to a contact assembly and a relay. The contact assembly comprises: a moving spring and a stationary contact set, wherein two ends of the moving spring can move relative to the stationary contact set so as to make contact with or disengage from the stationary contact set; the stationary contact set comprises two stationary contacts; a recess is provided on one side of each stationary contact; in the circumferential direction of each stationary contact, the part of the stationary contact around the corresponding recess forms a contact contact area; and at least three moving spring contact portions are provided on one side of the moving spring, the at least three moving spring contact portions correspond to the contact contact areas of the two stationary contacts, and the moving spring contact portions are configured to make contact with or disengage from the contact contact areas corresponding thereto. In the contact assembly, at least three contact positions can be formed between the stationary contact set and the moving spring, so that the contact stability between the stationary contacts and the moving spring is ensured, and the possibility of vibration between the stationary contacts and the moving spring is reduced, thereby guaranteeing the structural performance of a relay.
Disclaimer: Curated by HT Syndication.
