MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202441101431 A) filed by Valeo Eautomotive Germany Gmbh on December 20, 2024, for Cooling Plate Design For Electronic Devices.
Inventors include Balaganesan, Thirumalaikumar; Amalraj, Paul-Micky; Baskaran, Jothimanikandan; Balan, Sree Krishna; Sathi, Praharsha-Reddy; Londhe, Ishwar; Sah, Mayur; and Marchi, Andrea.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: COOLING PLATE DESIGN FOR ELECTRONIC DEVICES The present subject matter relates to an electronic device (100) that includes a housing (102) in which a module (103) is disposed, and a cooling plate (104). The housing (102) includes a fluid inlet (108) and a fluid outlet (110), each terminating and open in an upward direction (114) directed towards the module (103). The cooling plate (104) is positioned between the housing (102) and the module (103). The cooling plate (104) includes multiple layers (106a; 106b; 106c; 106d; 106d) stacked together, each having patterned openings. The patterned openings in each of the multiple layers (106a; 106b; 106c; 106d; 106d) is aligned with corresponding patterned openings in adjacent layers to form a coolant flow path (300; 302a; 302b; 204a; 304b). Accordingly, a cooling medium flows from the fluid inlet (108), through the cooling plate (104) via the coolant flow path (300; 302a; 302b; 204a; 304b), and into the fluid outlet (110).
Disclaimer: Curated by HT Syndication.
