MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617084019 A) filed by Posco Co. , Ltd on July 08, 2026, for Copper Plated Austenitic Stainless Steel Coil.
Inventors include Kang, Hyunggu; Ryu, Hanjin; and Kim, Jinsuk.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: According to the present invention, there may be provided a copper plated austenitic stainless steel coil comprising: an austenitic stainless steel coil base material; and a copper plating layer provided on the outer surface of the base material, wherein the copper plating layer has an average thickness of 1-100 mu or less, and a ratio of the average thickness of the copper plating layer to the average thickness of the austenitic stainless steel coil base material is 0.2 or less.
Disclaimer: Curated by HT Syndication.
